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本公司代理的三磨所生產的劃片刀刀刃超薄且有超高強度，刀刃厚度最薄規(guī)格10-15微米，最厚超過100微米，滿足各種街區(qū)寬度、晶粒大小的尺寸要求，可以實現(xiàn)對超薄硅晶圓、小晶粒硅晶圓的高品質切割，避免背面崩角或裂片的現(xiàn)象，有效解決背崩難題。

The cutting blades produced by Sanmo are ultra-thin and have ultra-high strength. The thinnest blade thickness is 10-15 microns, and the thickest is over 100 microns, meeting the size requirements of various block widths and grain sizes. It can achieve high-quality cutting of ultra-thin silicon wafers and small grain silicon wafers, avoiding the phenomenon of back corner breakage or fragmentation, and effectively solving the problem of back breakage.